PRISM

THE CHALLENGE

Current methods for quantifying and identifying chemicals in waste emissions from semiconductor manufacturing are insufficient; the application of existing capture and destruction technologies to semiconductor-specific waste applications has yet to be thoroughly tested; and models to predict release and transformation reactions of chemicals in semiconductor process waste are still in development stages. The challenge is to define and develop comprehensive solutions and tools that can be rapidly implemented across the industry. To ensure long-term economic viability, the industry must better understand chemicals in waste emissions from fabs and proactively investigate potential treatment and recycling techniques to minimize waste and reduce total costs.

THE OPPORTUNITY

The objective of the PRISM program is the successful creation of end-to-end waste emission mitigation capabilities, integrating advanced analytical methods, abatement technologies, and predictive modeling to address the economic impact of semiconductor manufacturing. A critical feature of the program is that each task area can have a measurable and substantial impact on reducing waste emissions without altering process technology in production today. New chemistries or process equipment require years of development before they can be implemented into an existing process, and it can be cost-prohibitive to modify mature process technology, further limiting the near-term impact. The four main task areas for both wastewater and air include:

• Analysis: Developing novel techniques or optimizing existing methods for identifying and quantifying chemicals in waste emissions from fab processes. By analyzing samples from various fab processes, researchers will create comprehensive datasets of waste sources and emissions.
• Sensing: Assessing the viability of novel sensor and device technology to measure chemicals in wastewater and air emissions, developing real-time monitoring capabilities.
• Abatement: Evaluating existing waste abatement, capture, and destruction technologies to determine their effectiveness in semiconductor waste management systems. Comprehensive total cost of ownership (TCO) and life cycle assessments (LCA) will also be conducted to evaluate the financial and operational implications of adopting and scaling these technologies to accelerate future implementation.
• Modeling: Researchers will calibrate and validate existing waste emission release models and develop new models as needed to predict degradation pathways of chemicals during fab processes and abatement environments.