Statements of Support:
CHIPS for America NSTC Prototyping and NAPMP Advanced Packaging Piloting Facility (PPF)
Gina Raimondo
U.S. Secretary of Commerce
“A strong research and development ecosystem is essential to ensuring the United States remains at the forefront of semiconductor innovation. Arizona has long been a hub for technological progress, and this new facility will strengthen our domestic supply chain, drive advanced manufacturing breakthroughs, and secure America’s leadership in this critical industry. Thanks to the bipartisan CHIPS and Science Act, combined with the other two CHIPS for America R&D flagship facilities, we will help bring American innovations to the global market, further securing our national and economic security.”
Natalie Quillian
Deputy Chief of Staff, White House
“Thanks to the bipartisan CHIPS and Science act, we are investing at historic levels in the technologies of both today and tomorrow. Today’s announcement with ASU ensures the United States will continue to be a leader in research and development and win the future by investing in skilled workers, moonshot technologies, and the advancements needed to stay ahead in critical industries, such as AI.”
Deirdre Hanford
CEO, Natcast
“The PPF will play a critical role in advancing semiconductor innovation across the country. This facility will be a premier destination where researchers from industry, academia, startups, and the broader semiconductor ecosystem will convene to explore, experiment, and collaborate on the next generation of semiconductor and packaging technologies that will power the industries of the future.”
Gov. Katie Hobbs
Governor, Arizona
“Today’s announcement solidifies Arizona’s position as a global hub for advanced manufacturing and innovation. This flagship facility will serve as an anchor for Arizona’s thriving semiconductor ecosystem while supporting R&D and supply chain resiliency nationwide. This investment ensures the next generation of this critical, leading-edge technology is developed here in Arizona, while we support the workforce and jobs of the future. I’m grateful to Secretary Raimondo and the Commerce Department and our Arizona Congressional delegation for their support. I also want to recognize the hard work of the Arizona Commerce Authority, ASU, and all their partners to win this national laboratory for our state.”
Sen. Mark Kelly
Senator, Arizona
“This groundbreaking effort will mean that researchers and startups won’t need to go to China or Europe to test out their cutting-edge prototype microchips—they’ll be able to do that right here in America. Creating this world-class prototyping and packaging facility was a priority of mine when negotiating the Chips and Science Act. The United States must lead the way in semiconductor research and development, and there’s nowhere more appropriate for it than Arizona. The most advanced microchips in the world that power everything from AI to quantum computing will now be able to be developed, tested, manufactured, and packaged in our state. I’m grateful for Arizona State University’s commitment to being at the forefront of microchip innovation, and to the years of partnership between Arizona’s elected leaders—Republicans and Democrats—our business community, and our economic development leaders to make this happen.”
Sen. Ruben Gallego
Senator, Arizona
“Arizona continues to prove its role as not just a nationwide leader, but a global leader, in semiconductor research and development. With this announcement, our state will serve as a driver of innovation for the semiconductor ecosystem in the country while creating thousands of high-paying jobs for hardworking Arizonans. Today’s announcement is why I fought in Congress to get the Chips Act into law. Thank you to Arizona State University, our business leaders, and multiple administrations across the years for making this bipartisan achievement possible.”
Rep. Andy Biggs
U.S. Representative, Arizona
“Arizona is the ideal choice to host the co-located NSTC Prototyping and NAPMP Advanced Packaging Piloting Facility. With the fastest growing semiconductor ecosystem in the country, Arizona is ready to support the R&D, manufacturing, packaging, and workforce needs of the industry. It’s crucial that America continue to be a leader in semiconductor innovation and manufacturing, and Arizona is perfectly suited to be a part of that effort.”
Rep. Raul Grijalva
U.S. Representative, Arizona
“With this selection Arizona will remain a leader in the nation in developing next generation technology. It is my hope that with this critical investment we can demonstrate the ability to improve efficiency, streamline production, and reduce power consumption within semiconductor development.”
Rep. Abe Hamadeh
U.S. Representative, Arizona
“With this selection Arizona will remain a leader in the nation in developing next generation technology. It is my hope that with this critical investment we can demonstrate the ability to improve efficiency, streamline production, and reduce power consumption within semiconductor development.”
Rep. Greg Stanton
U.S. Representative, Arizona
“Future-defining advancements in technology like AI wouldn’t be possible without advanced packaging. It’s a national security imperative that the U.S. out-innovate our global competitors. Thanks to our CHIPS Act, this new Advanced Packaging Piloting Facility at ASU will help develop the next-generation technology America needs to compete and win on the world stage–and train the future of the semiconductor workforce here at home.”
Kate Gallego
Mayor, City of Phoenix
“Phoenix is proud to be home to the nation’s largest-ever foreign direct investment, Taiwan Semiconductor Manufacturing Company, which has sparked a wave of projects that are strengthening our local economy, driving innovation, and transforming lives across the region. The NSTC Prototyping and NAPMP Advanced Packaging Piloting Facility coming to the Valley is proof that our growing semiconductor ecosystem is positioning us as leaders not just in the U.S., but globally—from manufacturing to packaging. We are thankful for our ongoing partnership with ASU, which in addition to housing this new facility, is helping us build a pipeline of talent that will bolster this industry for decades to come. We look forward to continuing our work alongside academia, business partners, and strong Arizona leaders such as Senator Kelly to ensure the project is a huge success.”
Corey Woods
Mayor, City of Tempe
“Tempe and Arizona continue to be at the center of groundbreaking research and development, leading the way in next-generation technology. We are proud to be the home of this new flagship facility that will serve as a hub for semiconductor innovation nationwide. We thank our partners at ACA and ASU, which have developed a world-class research ecosystem right in our backyard to serve our community and beyond.”
Kevin Hartke
Mayor, City of Chander
“Today’s announcement builds upon the CHIPS for America vision by leveraging the Valley’s advanced manufacturing ecosystem and expanding innovation in the areas of semiconductor research and development. Our region offers the infrastructure, resources and talent for companies contributing to America’s strength and leadership in this vital industry.”
Jason Beck
Mayor, City of Peoria
“The selection of Arizona as the home for the NSTC Prototyping and NAPMP Advanced Packaging Piloting Facility is a testament to our state’s importance in semiconductor innovation and advanced technology. Peoria is proud to play a vital role in this ecosystem through our partnership with Amkor on their forthcoming cutting-edge advanced packaging and test facility. This initiative not only strengthens our local economy but also continues to solidify our region’s position as a global leader in semiconductor manufacturing and innovation. We look forward to continuing our collaboration with regional and national partners to drive this critical industry forward.”
Debbie Lesko
County Supervisor, Maricopa County
“I am excited to see that Arizona was selected to host a major facility for advanced semiconductor chips packaging. This significant decision from the federal government proves yet again that our state has one of the most business-friendly environments in the nation. I look forward to seeing the economic benefits for Arizona when this facility opens, and I am grateful to have been a part of this bipartisan effort to bring another CHIPS R&D operation to the Grand Canyon State.”
Mark Stewart
County Supervisor, Maricopa County
“The semiconductor industry is vital to onshoring critical technology that ensures the security and competitiveness of the United States. I applaud the collaboration between government, private organizations, and educational institutions in uniting local, state, and federal agencies to drive innovation, create jobs, and prepare a skilled workforce. Maricopa County is in full support of these efforts and excited to collaborate on this transformative initiative, building a brighter future for Arizona and strengthening America’s leadership in technology.”
Danny Seiden
President & CEO, Arizona Chamber of Commerce and Industry
“Today’s announcement is a huge win for Arizona and represents the culmination of many years of work to establish the best business environment in the country. This facility will serve as a magnet for companies from all over the country looking to advance R&D and represents another landmark expansion for Arizona’s semiconductor industry. I want to credit Sandra Watson and the ACA, ASU, and all the partners who supported this project.”
Sandra Watson
President & CEO, Arizona Commerce Authority
“This announcement is a testament to Arizona’s robust semiconductor ecosystem and national network of industry and research partners advancing technology innovation. We are incredibly grateful to Governor Hobbs, Senator Kelly, our Congressional delegation, the Arizona Legislature, the Commerce Department, Chips Office, Natcast, and all our industry partners for their leadership and collaboration. I especially want to recognize Dr. Michael Crow and his team at ASU for their steadfast partnership.”
Dr. Michaell Crow
President, Arizona State University
“This is the largest of three CHIPS R&D flagship facilities being launched that together represent the greatest national laboratory investments since those that came out of the Manhattan Project. The CHIPS R&D project will create a national lab that will be the final piece in a semiconductor ecosystem that serves the nation with research and development, manufacturing and workforce development all right here in Arizona. You’ll have all three things together in the same place to help the nation; Arizona will be the hub nationally – and ASU is at the center of the hub.”
Kevin Engel
Executive Vice President of Business Units, Amkor
“This facility promises to accelerate innovation that will advance U.S. competitiveness and supply chain resilience, and at Amkor, we look forward to supporting its long-term success.”
Dr. Prabu Raja
President, Semiconductor Products Group, Applied Materials
“Congratulations to the State of Arizona for being selected as the home of the NSTC Prototyping and NAPMP Advanced Packaging Piloting Facility. Applied Materials has a long and successful history of collaborating with industry and research partners in Arizona, and we are pleased to participate in the growth of the region in support of U.S. leadership in semiconductors.”
Hichem M’Saad
CEO & Chair of the Management Board, ASM
“We commend the choice to establish the NSTC Prototyping and NAPMP Advanced Packaging Piloting Facility in Arizona, a state at the forefront of a thriving semiconductor industry. This marks an exciting era for the industry and for ASM, as we celebrate nearly five decades of driving groundbreaking chip innovation in Arizona. This development is a pivotal moment in advancing collaborative research and innovation in advanced packaging, and we eagerly anticipate its lasting success.”
Rama Puligadda
Chief Technical Officer, Brewer Science
“We applaud the decision to locate the NSTC Prototyping and NAPMP Advanced Packaging Piloting Facility in Arizona. As Brewer Science continues to pioneer next-generation materials needed for chip innovation, we look forward to partnering on this important research effort for our industry and supporting its long-term success.”
Tim Olson
CEO, Deca Technologies
“This once in a generation investment will boost the entire semiconductor industry with powerful capabilities to further develop and scale new technologies. Deca and ASU have already established a broad-ranging cooperation centered on advanced packaging. With the new pilot facility investment in Arizona, we’ll no doubt see an influx of private-sector investments and collaborations, new partnerships and exciting new ideas that will accelerate America’s efforts to regain preeminence in the highly competitive global semiconductor industry.”
Steve Sanghi
CEO, President & Chair of the Board, Microchip Technology Inc.
“Arizona is home to a vibrant and rapidly expanding semiconductor ecosystem and is uniquely positioned to host this facility. We applaud the decision to locate the NSTC Prototyping and NAPMP Advanced Packaging Piloting Facility in Arizona and look forward to its long-term success.”
Sanjay Natarajan
Senior Vice President, Intel Corp.
“Intel applauds the U.S. Department of Commerce and Natcast’s decision to establish the NSTC Prototyping and NAPMP Advanced Packaging Piloting Facility in Arizona. Building on our 45-year legacy of innovation and investment in the state, Intel will actively collaborate with industry and research leaders at this facility to drive breakthrough advances in leading edge semiconductor and packaging technologies. We plan to provide our expertise and resources to accelerate innovation, strengthen supply chain resilience, and enhance U.S. competitiveness. Intel will play a vital role in ensuring the long-term success of this historic research initiative through direct engagement and strategic support.”
Dave Anderson
President, NY CREATES
“On behalf of NY CREATES, I would like to extend our congratulations to Arizona State University on being selected as the anticipated location for the CHIPS for America NSTC Prototyping and National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Piloting Facility, an NSTC and NAPMP facility. We welcome ASU as a critical peer supporting the NSTC’s mission, as NY CREATES hosts the CHIPS for America EUV Accelerator, a flagship NSTC facility at our Albany NanoTech Complex, North America’s most advanced non-profit semiconductor R&D center. Together, our collective efforts will drive transformative innovation, strengthen the U.S. semiconductor ecosystem, and ensure our nation’s leadership in next-generation technologies. We look forward to collaborating with ASU, Natcast, and the broader network of partners to advance the future of microelectronics.”
Mung Chiang
President & Roscoe H. George Distinguished Professor of Electrical and Computer Engineering, Purdue University
“On behalf of Purdue University, I am pleased to express our strong support for the new NSTC/NAPMP R&D facility that will further enhance America’s resurgence in semiconductor manufacturing across the country. The success of the CHIPS and Science Act in creating jobs, workforce and innovation will require a whole of nation approach. As the workforce-research center of a new, rapidly emerging semiconductor industry ecosystem in the Silicon Heartland with leading companies such as SK hynix, Purdue looks forward to building on our collaborations with ASU colleagues in this particular proposal to execute for its successful implementation in the coming years.”
Joe Stockunas
President, SEMI Americas
“SEMI applauds the U.S. Department of Commerce and Natcast.org for selecting ASU as one of the flagship R&D locations to facilitate academic and industry collaboration for 300mm front-end semiconductor manufacturing and advanced packaging. Arizona’s commitment to expanding semiconductor manufacturing and advance chip innovations has been bolstered by recent CHIPS Act investments, and having this facility as part of the growing local ecosystem is a natural fit.”
John Neuffer
President & CEO, Semiconductor Industry Association
“Today’s announcement is a welcome step forward for U.S. leadership in semiconductor innovation, marking significant progress in the implementation of the critical R&D programs enacted in the bipartisan CHIPS and Science Act. The new Arizona facility will benefit from – and build upon – the state’s already-strong semiconductor fabrication and advanced packaging ecosystem.
“For America to remain the world’s technology leader, it must continue to lead in semiconductor innovation. Driving forward U.S. research in chip prototyping and advanced packaging is critical to keeping America on top in chip technology. We look forward to continuing to work with leaders in Washington to ensure the CHIPS and Science Act’s R&D initiatives and manufacturing incentives remain on track to deliver big benefits for America’s economic strength, national security, and global competitiveness.”
Thomas Sonderman
CEO, SkyWater
“SkyWater is pioneering advancements for next-generation packaging, providing a historic opportunity for collaboration with industry and research leaders. We look forward to this partnership, ensuring we deliver the best ROI possible for this critical investment, while supporting its long-term success.”
Rose Castanares
President, TSMC Arizona
“This announcement is tremendous news for our industry as we begin a new year. Natcast’s decision to locate the NSTC Prototyping and NAPMP Advanced Packaging Piloting Facility in Arizona is one that will have wide-ranging positive benefits well beyond 2025. Arizona’s semiconductor footprint is rapidly expanding, and its leadership in both cutting-edge manufacturing and advanced packaging provides a one-of-a-kind opportunity to accelerate research and innovation. With our historic $65 billion investment, TSMC Arizona is deeply committed to our US operation, and we look forward to collaborating with industry peers, research leaders and Natcast on its advanced packaging priorities.”
Alexander N. Cartwright
President, University of Central Florida
“Arizona State University and the University of Central Florida have long been leaders in innovation and collaboration to solve the world‘s hardest problems. UCF is pleased to support ASU, the U.S. Department of Commerce, and Natcast’s efforts to invent the future of semiconductors and train the next generation of talent right here in the United States.”
Michael V. Drake
President, University of California
“The University of California applauds the selection of Arizona to host the CHIPS for America prototyping and packaging center, which will complement the CHIPS for America design and collaboration facility in Sunnyvale, California, previously announced in November. In partnership with Arizona State University, the University of California system is ready to get to work designing, prototyping, and packaging the next generation of semiconductors, while also training engineers to maintain U.S. semiconductor leadership through the 21st century and beyond.”